FUTURREX  POSITIVE RESIST PR1-1500A

Description 

 Positive Resist PR1-1500A is a positive tone photoresist designed for 365 or 436 nm 

wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. PR1-1500A excels in applications when superior 

adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 

with PR1-1500A. 

 These are the advantages of PR1-1500A over other resists: – superior resolution capability – fast photospeed – superior linewidth control due to suppression of reflective notching – substrate adhesion which is superior to that of any commercial positive resist – ease of removal after RIE process – shelf life exceeding 1 year at room temperature storage. 

 The formulation processing of PR1-1500A were designed with regard to 

occupational environmental safety. The principal solvent in PR1-1500A is 1

methoxy-2-propanol development of PR1-1500A is accomplished in a basic water 

solution. 

                              

Properties 

 Solids content (%)                                                                     22-25                                     

 Principal solvent                                                                        1-methoxy-2-propanol 

 Appearance                                                                                light yellow liquid 

 Coating characteristic                                                                 very uniform, striation free 

 Film thickness after 100°C oven bake for 15 minutes. 

            Coating spin speed, 40 s spin (rpm):                                           (nm) 

            1000                                                                                              2700-2900      

            1500                                                                                              2250-2450 

            2000                                                                                              1760-1960 

            3000                                                                                              1440-1640 

            4000                                                                                              1250-1450 

 

 Sensitivity (mJ/cm2 for 1 μm thick film): 

             365 nm exposure wavelength                                                      70 

             436 nm exposure wavelength                                                      40 

 Guaranteed shelf life at 25°C storage (years)                            1 

Processing 

1. Application of resist by spin coating at ed spin speed for 40 s. 

2. 100°C bake in a bake oven for 15 minutes or 120oC hotplate bake for 60 s. 

3. Resist exposure in a tool incorporating 365, 406 or 436 nm wavelengths. 

4. Resist development in Resist Developer RD6 by spray or immersion. 

5. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

6. Drying of resist. 

7. Removal of resist in Resist Remover RR4 or in acetone. 

 

      The above procedure refers to substrates, which are good conductors of heat such as silicon,  

      GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor  

      conductors of heat such as glass. 

 

Hling Precautions 

 

      Positive Resist PR1-1500A is a flammable liquid. Hle it with care. Keep it away heat, 

      sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched.  

      Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves   

      protective coating.