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集成电路用湿刻、反应离子束刻蚀、离子植入正胶PR1-500A

发布日期:2024/11/1 14:01:10

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集成电路用湿刻、反应离子束刻蚀、离子植入正胶PR1-500A
深圳市芯泰科光电有限公司
产品热线许经理 :13玖23八66554  扣扣:35捌9123零

FUTURREX  POSITIVE RESIST PR1-500A
Description 
 
? Positive Resist PR1-500A is a positive tone photoresist designed for 365 or 436 nm 
wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 
proximity printers contact printers. PR1-500A excels in applications when superior 
adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 
with PR1-500A. 
? These are the advantages of PR1-500A over other resists: - superior resolution capability - fast photospeed - superior linewidth control due to suppression of reflective notching - substrate adhesion which is superior to that of any commercial positive resist  - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage. 
? The formulation processing of PR1-500A were designed with regard to occupational 
environmental safety. The principal solvent in PR1-500A is 1-methoxy-2-propanol  
development of PR1-500A is accomplished in a basic water solution. 
 
                              
Properties 
 
    ?    Solids content (%)                                                                                    11-15                        
    ?    Principal solvent                                                                                       1-methoxy-2- 
                                                                                                                            propanol 
    ?    Appearance                                                                                              red yellow liquid 
    ?    Coating characteristic                                                                               very uniform,  
                                                                                                                            striation free 
    ?    Film thickness after 100°C oven bake for 15 minutes. 
           Coating spin speed, 40 s spin (rpm):                                                           (nm) 
           1000                                                                                                          720-820 
           2000                                                                                                          570-670 
3000                                                                                                    450-550 
4000                                                                                                    310-410 
           5000                                                                                                          270-370 
? Sensitivity (mJ/cm2 for 1 μm thick film): 
       365 nm exposure wavelength                                                                   70 
           436 nm exposure wavelength                                                                    40 
    ?    Guaranteed shelf life at 25°C storage (years)                                            1       
Processing 
 
1. Application of resist by spin coating at ed spin speed for 40 s. 
 
2. 120°C hotplate bake for 120 s or 100°C oven bake for 20 minutes. 
 
3. Resist exposure in a tool incorporating 365 or 436 nm wavelength. 
 
4. Develop the resist by immersion with agitation or by spraying with aqueous Resist 
Developer RD6 at a constant temperature in the 20-25 °C range until the exposed resist is 
developed away. Allow an additional 4 seconds for overdevelopment. 
      Development time for 0.5 μm thick film in RD6 is 8 s. 
      Development time for 0.5 μm thick film in RD6/water 3:1 is 20 s. 
 
5. Resist rinse in deionized water until water resistivity reaches prescribed limit. 
 
6. Drying of resist. 
 
7. Removal of resist in Resist Remover RR4 or in acetone. 
 
   Note: The above procedure refers to substrates, which are good conductors of heat such as  
   silicon, GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor  
   conductors of heat such as glass. 
 
 
 
Hling Precautions 
 
Positive Resist PR1-500A is a flammable liquid. Hle it with care. Keep it away heat, 
sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. Avoid 
contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves protective 
coating.