Description
? Positive Resist PR1-500A is a positive tone photoresist designed for 365 or 436 nm
wavelength exposure, using tools such as wafer steppers, scanning projection aligners,
proximity printers contact printers. PR1-500A excels in applications when superior
adhesion is required. Use of adhesion promoters, such as HMDS is not recommended
with PR1-500A.
? These are the advantages of PR1-500A over other resists: - superior resolution capability - fast photospeed - superior linewidth control due to suppression of reflective notching - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage.
? The formulation processing of PR1-500A were designed with regard to occupational
environmental safety. The principal solvent in PR1-500A is 1-methoxy-2-propanol
development of PR1-500A is accomplished in a basic water solution.
Properties
? Solids content (%) 11-15
? Principal solvent 1-methoxy-2-
propanol
? Appearance red yellow liquid
? Coating characteristic very uniform,
striation free
? Film thickness after 100°C oven bake for 15 minutes.
Coating spin speed, 40 s spin (rpm): (nm)
1000 720-820
2000 570-670
3000 450-550
4000 310-410
5000 270-370
? Sensitivity (mJ/cm2 for 1 μm thick film):
365 nm exposure wavelength 70
436 nm exposure wavelength 40
? Guaranteed shelf life at 25°C storage (years) 1
Processing
1. Application of resist by spin coating at ed spin speed for 40 s.
2. 120°C hotplate bake for 120 s or 100°C oven bake for 20 minutes.
3. Resist exposure in a tool incorporating 365 or 436 nm wavelength.
4. Develop the resist by immersion with agitation or by spraying with aqueous Resist
Developer RD6 at a constant temperature in the 20-25 °C range until the exposed resist is
developed away. Allow an additional 4 seconds for overdevelopment.
Development time for 0.5 μm thick film in RD6 is 8 s.
Development time for 0.5 μm thick film in RD6/water 3:1 is 20 s.
5. Resist rinse in deionized water until water resistivity reaches prescribed limit.
6. Drying of resist.
7. Removal of resist in Resist Remover RR4 or in acetone.
Note: The above procedure refers to substrates, which are good conductors of heat such as
silicon, GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor
conductors of heat such as glass.
Hling Precautions
Positive Resist PR1-500A is a flammable liquid. Hle it with care. Keep it away heat,
sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. Avoid
contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves protective
coating.