Description
? Positive Resist PR1-9000A is a positive tone photoresist designed for 365 or 436 nm
wavelength exposure, using tools such as wafer steppers, scanning projection aligners,
proximity printers contact printers. PR1-9000A excels in applications when superior
adhesion is required. Use of adhesion promoters, such as HMDS is not recommended
with PR1-9000A.
? The following are advantages of PR1-9000A over other resists: - superior resolution capability - fast photospeed - superior linewidth control due to suppression of reflective notching - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage.
? The formulation processing of PR1-9000A were designed with regard to occupational
environmental safety. The principal solvent in PR1-9000A is 1-methoxy-2-propanol
development of PR1-9000A is accomplished in a basic water solution.
Properties
? Solids content (%) 43-47
? Principal solvent 1-methoxy-2-
propanol
? Appearance light yellow liquid
? Coating characteristic very uniform,
striation free
? Film thickness after 115°C hotplate bake for 6 minutes.
Coating spin speed, 40 s spin (rpm): (nm)
800 17100-18900
2000 11276-12463
3000 8550-9450
4000 7738-8552
5000 6716-7423
Sensitivity (mJ/cm2 for 1 μm thick film):
365 nm exposure wavelength 70
436 nm exposure wavelength 40
? Guaranteed shelf life at 25°C storage (years) 2
Processing
1. Application of resist by spin coating at ed spin speed for 40 s.
2. Application of Edge Bead Remover EBR1 to bottom edge of the coated wafer for 10s,
until 5 s before completion of spin cycle.
3. 100°C bake in a bake oven for 15 minutes or 115oC hotplate bake for 240 s.
4. Resist exposure with a tool emitting 365, 406 or 436 nm wavelengths.
5. Resist development in Resist Developer RD6 by spray or immersion.
6. Resist rinse in deionized water until water resistivity reaches prescribed limit.
7. Drying of resist.
8. Removal of resist in Resist Remover RR4 or in acetone.
9. The above procedure refers to substrates, which are good conductors of heat such as
silicon, GaAs etc. Bake times should be increased 3.5 times for substrates that are poor
conductors of heat such as glass.
Hling Precautions
Positive Resist PR1-9000A is a flammable liquid. Hle it with care. Keep it away heat,
sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched.
Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves
protective coating.