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用于研究所课题的耐高温、干法蚀刻专用正胶PR1-1500A

发布日期:2024/11/1 14:01:10

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用于研究所课题的耐高温、干法蚀刻专用正胶PR1-1500A
深圳市芯泰科光电有限公司
产品热线许经理 :13玖23八66554  扣扣:35捌9123零

FUTURREX  POSITIVE RESIST PR1-1500A
Description 
 Positive Resist PR1-1500A is a positive tone photoresist designed for 365 or 436 nm 
wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 
proximity printers contact printers. PR1-1500A excels in applications when superior 
adhesion is required. Use of adhesion promoters, such as HMDS is not recommended 
with PR1-1500A. 
 These are the advantages of PR1-1500A over other resists: – superior resolution capability – fast photospeed – superior linewidth control due to suppression of reflective notching – substrate adhesion which is superior to that of any commercial positive resist – ease of removal after RIE process – shelf life exceeding 1 year at room temperature storage. 
 The formulation processing of PR1-1500A were designed with regard to 
occupational environmental safety. The principal solvent in PR1-1500A is 1
methoxy-2-propanol development of PR1-1500A is accomplished in a basic water 
solution. 
                              
Properties 
 Solids content (%)                                                                     22-25                                     
 Principal solvent                                                                        1-methoxy-2-propanol 
 Appearance                                                                                light yellow liquid 
 Coating characteristic                                                                 very uniform, striation free 
 Film thickness after 100°C oven bake for 15 minutes. 
            Coating spin speed, 40 s spin (rpm):                                           (nm) 
            1000                                                                                              2700-2900      
            1500                                                                                              2250-2450 
            2000                                                                                              1760-1960 
            3000                                                                                              1440-1640 
            4000                                                                                              1250-1450 
 
 Sensitivity (mJ/cm2 for 1 μm thick film): 
             365 nm exposure wavelength                                                      70 
             436 nm exposure wavelength                                                      40 
 Guaranteed shelf life at 25°C storage (years)                            1 
Processing 
1. Application of resist by spin coating at ed spin speed for 40 s. 
2. 100°C bake in a bake oven for 15 minutes or 120oC hotplate bake for 60 s. 
3. Resist exposure in a tool incorporating 365, 406 or 436 nm wavelengths. 
4. Resist development in Resist Developer RD6 by spray or immersion. 
5. Resist rinse in deionized water until water resistivity reaches prescribed limit. 
6. Drying of resist. 
7. Removal of resist in Resist Remover RR4 or in acetone. 
 
      The above procedure refers to substrates, which are good conductors of heat such as silicon,  
      GaAs etc. Bake times need to be increased 3.5 times for substrates, which are poor  
      conductors of heat such as glass. 
 
Hling Precautions 
 
      Positive Resist PR1-1500A is a flammable liquid. Hle it with care. Keep it away heat, 
      sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched.  
      Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves   
      protective coating.