FUTURREX NEGATIVE RESIST NR9-3000P

Description 

 

? Negative Resist NR9-3000P is a negative tone photoresist designed for 365 nm 

wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. 

? These are the advantages of NR9-3000P over other resists: - superior resolution capability - fast photospeed - fast develop time - temperature resistance of up to 100°C - superior adhesion in plating wet etching applications - easy resist removal in Resist Remover RR5 - shelf life exceeding 3 years at room temperature storage 

? The formulation processing of NR9-3000P were designed with regard to occupational 

environmental safety. The principal solvent in NR9-3000P is cyclohexanone  

development of NR9-3000P is accomplished in a basic water solution. 

    

        

Properties 

 

    ?    Solids content (%)                                                                                     31-35                       

    ?    Principal solvent                                                                                        cyclohexanone 

    ?    Appearance                                                                                               light yellow liquid 

    ?    Coating characteristic                                                                                very uniform,  

                                                                                                                             striation free 

    ?    Film thickness after 150°C hotplate bake for 60 s. 

           Coating spin speed, 40 s spin (rpm):                                                             (nm) 

800                                                                                                            5700-6300 

3000                                                                                                    2850-3150 

4000                                                                                                    2460-2720 

5000                                                                                                    2140-2326 

 

    ?    Sensitivity at 365 nm exposure wavelength (mJ/cm2 for 1μm thick film)   21 

    ?    Guaranteed shelf life at 25°C storage (years)                                           3 

Processing

Application of resist by spin coating at ed spin speed for 40 s. 

Begin dispensing Edge Bead Remover EBR2 simultaneously onto the top bottom 

surfaces of the spinning, coated substrate through nozzles 0.5-1.0 cm the edge of 

the substrate as soon as edge bead forms (3-5 s after ceasing resist dispense). Stop 

dispensing EBR2 5 seconds prior to completion of spin coating cycle.

150°C hotplate bake for 60 s. (softbake). 

Resist exposure with a tool emitting 365 nm wavelength. 

100°C hotplate bake for 60 s. (post-exposure bake).

Resist development in Resist Developer RD6 by spray or immersion. 

Development time for 3 μm thick film, for example, is 17 s. 

Resist rinse in deionized water until water resistivity reaches prescribed limit. 

Drying of resist. 

Removal of resist in Resist Remover RR5 at room temperature. 

    Note: The above procedure refers to substrates, which are good conductors of heat such as  

    silicon, GaAs etc. Bake times need to be increased by a factor of 3.5 for substrates that are  

    poor conductors of heat such as glass. 

Hling Precautions 

Negative Resist NR9-3000P is a flammable liquid. Hle it with care. Keep it away  

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. 

Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves  

protective coating.