FUTURREX NEGATIVE RESIST NR21-20000P

NEGATIVE RESIST NR21-20000P 

 

Description 

 

? Negative Resist NR21-20000P is a negative tone photoresist designed for thick film 

applications is compatible with UV exposure tools emitting at the 365 nm 

wavelength, including wafer steppers, scanning projection aligners, proximity printers 

contact printers. 

 

? The following are advantages of NR21-20000P over other resists: - superior resolution capability - fast development time - superb adhesion in plating - easy resist removal using Resist Remover RR41 

 

? The formulation processing of NR21-20000P were designed with regard to 

occupational environmental safety. The principal solvent in NR21-20000P is 

gammabutyrolactone development of NR21-20000P is accomplished in basic water 

solution. 

 

Properties 

? Solids content (%)                                                                           50-56 

? Principal solvent                                                                              gammabutyrolactone 

? Appearance                                                                                     light yellow liquid 

? Coating characteristic                                                                      uniform, striation free 

? Film thickness: 

 

Softbake        Softbake        Post-Exposure 

Coating       Coating      Hotplate        Hotplate         Hotplate             Film 

Spin Speed Time           Bake Time    Bake Time      Bake Time         Thickness 

(rpm)            (s)              (s) 80°C         (s) 150°C        (s) 80°C              (nm) 

             1050            10                600                300                  600                     115000-125000 

1200            10                600                300                  600                     95000-105000 

1500            10                -                     180                  300                     48000-52000 

3150            10                -                     180                  300                     38000-42000 

3000            40                -                     120                  300                     18000-22000 

 

? Sensitivity at 365 nm exposure wavelength (mJ/cm2 for 1 μm thick film): 46 

? Guaranteed shelf life at 5°C storage (years): 1 

Processing 

1. Application of resist by spin coating at a ed spin speed for a time designated in 

film thickness vs. spin speed on page 1. 

2. Softbake procedure is determined by film thickness. Please refer to bake instructions

on  page 1. 

3. Resist exposure in a tool emitting 365 nm wavelength. Please determine 365 nm 

exposure light intensity (mW/cm2) with a proper gauge. Multiply resist thickness (μm) by 

46 mJ/cm2 to obtain exposure dose. Divide exposure dose (mJ/cm2) by light intensity 

(mW/cm2) at 365 nm wavelength to obtain exposure time (s). 

4. Post-exposure bake on hotplate at 80°C for a time depending on a film thickness. 

Please refer to bake instructions on page 1. 

5. Resist development in Resist Developer RD6 by spray or immersion at 20-25 °C. 

Please ensure that there is no exposed resist thickness loss during development. 

Exposed resist thickness loss during development would indicate improper exposure 

energy /or bake conditions. 

6. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

7. Drying of resist. 

8. Removal of resist in Resist Remover RR41. 

The above procedure refers to substrates that are good

 conductors of heat such as 

silicon, GaAs, InP, etc. Hotplate temperatures need to be adjusted such that surface 

temperature of substrates that are poor

 conductors of heat reach designated 

temperatures for softbake post-exposure bake. Always use external thermocouples 

when measuring surface temperatures. 

Patterned images of 70 μm thick Negative Resist NR21-20000P.  

Exposure Tool: MA 200 SUSSMicroTec with 100 μm proximity gap. 

Hling Precautions 

Negative Resist NR21-20000P is a flammable liquid. Hle it with care. Keep it away 

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed 

or touched. Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber 

gloves protective coating.