FUTURREX  NEGATIVE RESIST NR71-3000PY

Description 

? Negative Resist NR71-3000PY is a negative tone photoresist designed for 365 nm 

wavelength exposure, using tools such as wafer steppers, scanning projection aligners, 

proximity printers contact printers. 

? After resist development NR71-3000PY exhibits a negative-sloping resist sidewall profile, 

which facilitates a simple resist lift-off process. 

? These are advantages of NR71-3000PY over other resists: - superior resolution capability - fast develop time - easy adjustment of the degree of resist undercut as a function of exposure energy - superior temperature resistance of up to 180°C - superior film thickness uniformity-     elimination of adhesion promoters such as HMDS- shelf life exceeding 3 years at room temperature storage. 

? The formulation processing of NR71-3000PY were designed with regard to 

occupational environmental safety. The principal solvent in NR71-3000PY is 

gamma butyrolactone development of NR71-3000PY is accomplished in a basic 

water solution. 

                              

Properties 

    ?    Solids content (%)                                                               31-35                   

    ?    Principal solvent                                                                                             gamma butyrolactone 

    ?    Appearance                                                             light yellow 

  liquid 

    ?    Coating characteristic                                                very uniform, 

  striation free 

    ?    Film thickness after 150°C hotplate bake for 60 s  (nm)

           Coating spin speed, 40 s spin (rpm):                                           

800                                                     5700-6300 

3000 2850-3150 

4000 2460-2720 

5000 2140-2326 

 

    ?    Sensitivity at 365 nm exposure wavelength (mJ/cm2 for 1 μm thick film)    190 

    ?    Guaranteed shelf life at 25°C storage (years)                                       3      

Processing

1.Application of resist by spin coating at ed spin speed for 40 s. 

2. 150°C hotplate bake for 60 s;  165°C hotplate bake for 240 s (softbake) 

3.Resist exposure with a tool emitting 365 nm wavelength. 

4. 100°C hotplate bake for 60 s; 110°C hotplate bake for 240 s (post-exposure bake) 

Resist development in Resist Developer RD6 by spray or immersion. 

Development time for 3 μm thick film, for example, is 30 s. 

Resist rinse in deionized water until water resistivity reaches prescribed limit. 

Drying of resist. 

Removal of resist in Resist Remover RR41. 

For good conductors of heat such as Si, GaAs, InP, etc.         

For 1mm thick glass substrate.

 Hling Precautions 

Negative Resist NR71-3000PY is a combustible liquid. Hle it with care. Keep it away  

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed or touched. 

Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves  

protective coating.