FUTURREX NEGATIVE RESIST NR2-8000P

NEGATIVE RESIST NR2-8000P 

 

Description 

 

? Negative Resist NR2-8000P is a negative tone photoresist designed for thick film 

applications is compatible with UV exposure tools emitting at the 365 nm exposure 

wavelength, including wafer steppers, scanning projection aligners, proximity printers 

contact printers. 

 

? The following are the advantages of NR2-8000P over other resists:  -     superior resolution capability  -     high photospeed which translates into high exposure throughput  -     fast develop time  -     superior adhesion in plating wet etching   -     easy resist removal in Resist Remover RR41  -     shelf life exceeding 1 year at proper storage temperatures. 

 

? The formulation processing of NR2-8000P were designed with regard to 

occupational environmental safety. The principal solvent in NR2-8000P is 

gammabutyrolactone development of NR2-8000P is accomplished in a  

basic water solution. 

 

Properties 

?     Solids content (%)                                                                       45-50 

?     Principal solvent                                                                          gammabutyrolactone 

?     Appearance                                                                                 light yellow liquid 

?     Coating characteristic                                                                  uniform, striation free 

?     Film thickness: 

 

1st Soft         2nd Soft     Post-Exposure 

Coating       Spin          Hotplate       Hotplate         Hotplate                   Film 

Spin Speed Time       Bake Time    Bake Time      Bake Time             Thickness 

(rpm)            (s)            (s) 80°C         (s) 150°C        (s) 80°C                    (nm)    

             500              5                300 followed by 450                 600                    95000-105000 

1000            5                300 followed by 120                 300                    47000-53000 

2000            5                0                        60                   300                    18000-22000 

2500            40              0                        60                   180                     9000-10000 

3000            40              0                        60                   180                     8000-8300 

4000            40              0                        60                   180                     6500-6800 

 

? Sensitivity at 365 nm exposure wavelength (mJ/cm2 for 1 μm thick film):      46 

? Guaranteed shelf life at 5°C storage (years):                                                  1

Processing 

1.Application of resist by spin coating at a ed spin speed for a time designated in 

film thickness vs. spin speed on page 1

2. Softbake procedure is determined by film thickness. Please refer to bake instructions 

on page 1. 

3. Resist exposure in a tool emitting 365 nm wavelength. Please determine 365 nm 

exposure light intensity (mW/cm2) with a proper gauge. Multiply resist thickness (μm) by 

46 mJ/cm2 to obtain exposure dose. Divide exposure dose (mJ/cm2) by light intensity 

(mW/cm2) at 365 nm wavelength to obtain exposure time (s) on silicon substrates. 

4. Post-exposure bake on hotplate at 80°C for a time depending on a film thickness. 

Please refer to bake instructions on page 1. 

5. Resist development in Resist Developer RD6 by spray or immersion at 20-25 °C. 

Please ensure that there is no exposed resist thickness loss during development. 

Exposed resist thickness loss during development would indicate improper exposure 

energy /or bake conditions. 

6. Resist rinse in deionized water until water resistivity reaches prescribed limit. 

7. Drying of resist. 

8. Removal of resist in Resist Remover RR41. 

The above procedure refers to substrates that are good

 conductors of heat such as 

silicon, GaAs, InP, etc. Hotplate temperatures need to be adjusted such that surface 

temperature of substrates that are poor

 conductors of heat reach designated 

temperatures for softbake post-exposure bake. Always use external thermocouples 

when measuring surface temperatures. 

Hling Precautions 

Negative Resist NR2-8000P is a flammable liquid. Hle it with care. Keep it away 

heat, sparks flames. Use adequate ventilation. It may be harmful if swallowed 

or touched. Avoid contact with liquid, vapor or spray mist. Wear chemical goggles, rubber 

gloves protective coating.