半导体、板基封装用干膜去胶液、剥离液Stripper ZS-220
2026年推荐半导体、板基封装用、干膜去胶液、剥离液Stripper ZS-220
Dry Film Photoresist Stripper ZS-220 for ASE
半导体、板基封装用、干膜去胶液、剥离液
深圳市芯泰科光电有限公司
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Dry Film Photoresist Stripper ZS-220 for ASE
Outline
? 1. Dry film photoresist working mechanism
? 2. Process temperature vs process time
? 3. Water content (moisture level) vs stripping performance
? 4. Bath-life study without wafer loading
? 5. Bath-life study with wafer loading
? 6. Metal corrosion study
? 7. ZS-200 failure mode & root cause
? 8. Monitoring method
? 9. Strength of ZS-200
? 10. ZS-200 process control flow
Dry film Photoresist Working Mechanism
Dry film Photoresist Working Mechanism
Process temperature vs process time
Process tool: beaker with stirrer
? Test vehicle: ASE test wafer coupon (2.5x4cm) dipping in 50g stripper
? Metrology: Optical microscope
? Split condition test procedure:
– Process temperature: 50 to 90 C
– Record break through time
– Residual PR amount compariso
Process temperature vs process time
ZS-200 is capable to strip off ASE dry-film resist within 50~90C.
Shorter process time required for higher temperature.
Water content (moisture level) vs stripping performance
Process tool: beaker with stirrer
? Test vehicle: ASE test wafer coupon(2.5x4cm)
? Metrology: Optical microscope
? Prepare 4 stripper sample with different H2O contents:
– (1) stard (2) +5% DIW (3) +10% DIW (4) +15% DIW
? Test stripping time PR removal performance by break trough time residual PR amount
Water content vs stripping performance
Performance of ZS-200 is not sensitive to water content. Higher water content resulted in a little shorter process time but may have lower resist loading shorter bath-life.
Bath-life study without wafer loading
Process tool: beaker with stirrer (w/o cover)
? Test vehicle: ASE test wafer coupon (2.5x4cm)
? Metrology: Optical microscope
? Heat the stripper bath to 70C up to 48 hours
? Record evaporation amount every 4 hours
? Collect 200mL sample every 4 hours
? Do PR stripping capability test using the collected stripper samples
Bath-life study without wafer loading
ZS-200 bath life without wafer loading 72 C
Bath-life study with wafer loading
Process tool: beaker with stirrer (w/o cover)
? Test vehicle: ASE test wafer coupon (2.5x4cm)
? Metrology: Optical microscope
? Heat the stripper bath to 70C
? Do 1 coupon stripping in beaker each time continuously up to 20 coupons
Bath-life study with wafer loading
ZS-200 bath life with wafer loading: 12hr
Metal corrosion study by analyzing dissolved metal contents in stripper bath
Process tool: beaker with stirrer (w/o cover)
? Test vehicle: ASE test wafer coupon (2.5x4cm)
? Metrology: ICP-AES
? Do 1 coupon (2.5x4cm) stripping in 100mL bath for each split condition
? Collect stripper sample do metal contents analysis using ICP-AES
Metal corrosion study by analyzing dissolved metal contents in stripper bath
ZS-200 Failure Mode & Root Cause
Incomplete Photoresist Removed
a. Solubility saturation
(1) Photoresist solid content too high
(2) H2O out of range b. Air oxidation/thermal degradation of bond-breaking agent ?Metal Film Corrosion a. pH increase due to increase of H2O%
b. Air oxidation/thermal degradation of corrosion inhibitor
Monitoring Method
1. H2O content: Karl-Fischer titration
2. Amine content: pH meter titration
3. Metal corrosion: Cu etch rate
Strength of ZS-200
?High bp, low evaporation:
– No/low odor at process
– Low volatile consumption/low VOC pollution
– Longer bath life
? No hazardous component used:
– No NMP, no DMAc, no DMF, no catechol
? Low waste treatment concern:
– No DMSO or any sulfur
-containing component (cause waste water treatment issue)
– All components can be incinerated (low waste treatment cost)
Strength of ZS-200
?Performance is not sensitive to H2O content:
– Large H2O tolerance window
– No severe environmental control necessary for processing
– Easy to control product (ZS-200) spec/performance
? Low metal corrosion:
– Extremely low Cu loss in stripping process
– Low Al loss
ZS-200 Process Control Flow
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